uMUX Chip Inventory¶
This is a reference on the available uMUX chips that we have at Fermilab. Please update as anything changes.
|Name||MUX factor||NIST design||Location||Photoresist removed||Mounted||Bonded||Defects||Comment|
|uMUX 1||32x||300kHz-4.0||Lab D cleanroom||Y||N||N||microwave line shorted to GND||previously bonded|
|uMUX 2||64x||100k v1||Lab D cleanroom||Y||Y||Y (no pcb)||used for bonding tests, heavily bonded||input coils bonded; in parallel?|
|uMUX 3||32x||uMUX 16c||at Argonne, given to Gensheng Wang||Y||Y||Y||input coils bonded serially; not working?|
|uMUX 4||32x||uMUX 16c||Lab D cleanroom||Y||Y||Y (no pcb)||input coils not bonded; not working?|
|uMUX 5, chip 1 ((0,-7) W0 band 9)||64x||uMUX v3.1 (check this)||Lab D cleanroom||Y||Y||Y||tested in run 01, from bad fab batch|
|uMUX 5, chip 2 ((-1,-4) W0 band 8)||64x||uMUX v3.1 (check this)||Lab D cleanroom, gelpak||N||N||N||from bad fab batch|
|uMUX 6, chip 1 ((0,-6) W3 band 10)||64x||uMUX 100k v2.0||Lab D cleanroom||Y||Y||Y||flux ramp shorted to GND||photoresist removed, mounted in sample box, in cleanroom|
|uMUX 6, chip 2 ((-1,-4) W3 band 11)||64x||uMUX 100k v2.0||in ADR, in 512x box||Y||Y||Y|
Abbreviated Assembly/Disassembly Log¶
Please add a line below whenever any parts of a uMUX package are modified, bonded, assembled, disassembled, etc. Log started 2020-01-16.
- 2020-01-17: uMUX 1 removed from 512x box. uMUX 6 chip 2 removed from small box, then mounted in 512x box.
- 2020-01-27: uMUX 6 chip 2 bonded in 512x box. uMUX 5 chip 1 removed from ADR and put in dry box in Lab D cleanroom.
2019-09-23 Bonding uMUX 2 for second time
2019-09-26 Bonding tests with uMUX 2
2019-10-01 Bonding, mounting, uMUX 5 chip 1
2019-10-01 Bonding, mounting, uMUX 6 chip 1
2019-12-20 Mounting detectors in 512x box
2020-01-09 Probing uMUX chips
2020-01-17 Installing uMUX 6 chip 2
2020-01-27 Bonding uMUX 6 chip 2 in 512x box
Assembly and Bonding Procedures¶
- Clean photoresist off chip
- Clean microwave launches
- Check distances of chip from grounds
- Check that enough glue has been applied to launches and chip (not "bouncy")